您好!歡迎訪問深圳市托普科實(shí)業(yè)有限公司官方網(wǎng)站!
深圳市托普科實(shí)業(yè)有限公司
聯(lián)系人:向經(jīng)理 135-1032-9527
郵箱:market@topsmt.com
網(wǎng)址:m.hbjyt.org.cn
地址:深圳市寶安區(qū)福海街道翰宇灣區(qū)創(chuàng)新港4號樓201
今天講講回流焊的中英文術(shù)語,需要的朋友可以做下參考
1. Solder Paste Technology(焊膏工藝)
Solder Powder ( 錫粉) 休息再來接著說。
Solder Paste Rheology(錫膏流變學(xué))
Solder Paste Composition &Manufacturing(錫膏成分和制造)
2. Fundamentals of Solders andSoldering(焊料及焊接基礎(chǔ)知識)
Soldering Theory(焊接理論)
Microstructure and Soldering(顯微結(jié)構(gòu)及焊接)
Effect of Elemental Constituents onWetting(焊料成分對潤濕的影響)
Effect of Impurities on Soldering(雜質(zhì)對焊接的影響)
3. SMT Problems Occurred Prior toReflow(回流前SMT問題)
Flux Separation(助焊劑分離)
Paste Hardening(焊膏硬化)
Poor Stencil Life(網(wǎng)板壽命問題)
Poor Print Thickness(印刷厚度不理想)
Poor Paste Release From Squeegee(錫膏脫離刮刀問題)
Smear(印錫模糊)
Insufficiency(印錫不足)
Needle Clogging(針孔堵塞)
Slump(塌落)
Low Tack(低粘性)
Short Tack Time (粘性時間短)
4. SMT Problems Occurred DuringReflow(回流過程中的SMT問題)
Cold Joints(冷焊)
Nonwetting(不潤濕)
Dewetting(反潤濕)
Leaching(浸析)
Interllics(金屬互化物)
Tombstoning(立碑)
Skewing(歪斜)
Wicking(焊料上吸)
Bridging(橋連)
Voiding(空洞)
Opening(開路)
Solder Balling(錫球)
Solder Beading(錫珠)
Spattering(飛濺)
5. SMT Problems Occurred at Post ReflowStage(回流后問題)
White Residue(白色殘留物)
Charred Residue(炭化殘留物)
Poor Probing Contact(探針測接問題)
Surface Insulation Resistance or ElectrochemicalMigration Failure
(表面絕緣阻抗或電化遷移缺陷)
Delamination/Voiding/Non-curing Of ConformalCoating/Encapsulants
(分層 / 空洞 / 敷形涂覆或包封的固化問題)
6. Challenges at BGA and CSP Assembly and ReworkStage
(BGA、CSP組裝和翻修的挑戰(zhàn))
Starved Solder Joint(少錫焊點(diǎn))
Poor Self-Alignment(自對位問題)
Poor Wetting(潤濕不佳)
Voiding(空洞)
Bridging(橋連)
Uneven Joint Height(焊點(diǎn)高度不均)
Open(開路)
Popcorn and Delamination(爆米花和分層)
Solder Webbing(錫網(wǎng))
7. Optimizing Reflow Profile via Defect MechanismsAnalysis
(回流曲線優(yōu)化與缺陷機(jī)理分析)
Flux Reaction(助焊劑反應(yīng))
Peak Temperature(峰值溫度)
Cooling Stage(冷卻階段)
Heating Stage(加熱階段)
Timing Considerations(時間研究)
Optimization of Profile(曲線優(yōu)化)
Comparison with ConventionalProfiles(與傳統(tǒng)曲線的比較)
Discussion(討論)
Implementing Linear Ramp Up Profile(斜坡式曲線)
8. Problems Occurred at Flip Chip ReflowAttachment
(倒裝晶片回流期間發(fā)生的問題)
Misalignment(位置不準(zhǔn))
Poor Wetting(潤濕不佳)
Solder Voiding(空洞)
Underfill Voiding(底部填充空洞)
Bridging(橋連)
Open(開路)
Underfill Crack(底部填充裂縫)
Delamination(分層)
Filler Segregation(填充分離)
Insufficient Underfilling(底部填充不充分)
SMT工藝-回流焊常用中英文術(shù)語講解完畢。
添加微信好友
聯(lián)系人:向經(jīng)理 135-1032-9527
郵箱:market@topsmt.com
地址:深圳市寶安區(qū)福海街道翰宇灣區(qū)創(chuàng)新港4號樓201
網(wǎng)址:m.hbjyt.org.cn